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Home Others Wafer Bonding Machine for...

Mitsubishi Heavy Industries America, Inc. - a wholly owned subsidiary of Mitsubishi Heavy Industries Ltd. (Japan)

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Wafer Bonding Machine for MEMS or 3D integration

BOND MEISTER is the wafer bonder for MEMS or 3D integration worth the name of MEISTER, which integrated manufacturing technology and process technology that Mitsubishi Heavy Industries has cultivated for many years.

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